www.德州仪器.com
特性
dct 或者 dcu pACKAGE
(t运算 视图)
1
2
3
4
8
7
6
5
1A
1B
2Y
地
V
CC
1Y
2B
2A
4
3
2
1
5
6
7
8
地
2Y
1B
1A
2A
2B
1Y
V
CC
yep 或者 yzp pACKAGE
(bottom 视图)
描述/orderinginformation
SN74LVC2G132
dual2-inputnandgate
withschmitt-triggerinputs
SCES547A–FEBRUARY2004–REVISEDJUNE2005
•
AvailableinTexasInstrumentsNanoStar™
andNanoFree™Packages
•
supports5-vv
CC
运作
•
inputsacceptvoltagesto5.5v
•
Maxt
pd
of5.3nsat3.3v
•
lowpowerconsumption,10-
µ
AMaxI
CC
•±
24-maoutputdriveat3.3v
•
TypicalV
OLP
(outputgroundbounce)<0.8v
atV
CC
=3.3v,t
一个
=25°C
•
TypicalV
OHV
(outputv
OH
undershoot)>2vat
V
CC
=3.3v,t
一个
=25°C
•
I
止
supportspartial-电源-downmode
运作
•
获得-upperformanceexceeds100maper
jesd78,classii
•
ESDProtectionExceedsJESD22
–2000-vhuman-bodymodel(a114-一个)
–200-vmachinemodel(a115-一个)
–1000-vcharged-devicemodel(c101)
thisdual2-inputnandgatewithschmitt-triggerinputsisdesignedfor1.65-vto5.5-vv
CC
运作.
TheSN74LVC2G132containstwoinvertersandperformstheBooleanfunctionY=A
⋅
BorY=A+Binpositive
逻辑.thedevicefunctionsastwoindependentinverters,butbecauseofschmittaction,ithasdifferentinput
thresholdlevelsforpositive-going(v
T+
)andnegative-going(v
t-
)信号.
nanostar™andnanofree™packagetechnologyisamajorbreakthroughinicpackagingconcepts,usingthe
dieasthepackage.
thisdevicecanbetriggeredfromtheslowestofinputrampsandstillgivecleanjitter-freeoutputsignals.
ORDERINGINFORMATION
T
一个
包装
(1)
orderablepartnumbertop-sidemarking
(2)
nanostar™–wcsp(dsbga)
SN74LVC2G132YEPR
0.23-mmlargebump–yep
reelof3000___d5_
nanofree™–wcsp(dsbga)
0.23-mmlargebump–yzpsn74lvc2g132yzpr
–40°Cto85°C
(铅-自由)
ssop–dctreelof3000sn74lvc2g132dctrc3b___
Reelof3000SN74LVC2G132DCUR
vssop–dcuc3b_
Reelof250SN74LVC2G132DCUT
(1)packagedrawings,standardpackingquantities,thermaldata,符号化,andpcbdesignguidelinesareavailableat
www.德州仪器.com/sc/包装.
(2)dct:theactualtop-sidemarkinghasthreeadditionalcharactersthatdesignatetheyear,month,andassembly/testsite.
dcu:theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatestheassembly/testsite.
yep/yzp:theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,month,andsequencecode,andonefollowing
charactertodesignatetheassembly/testsite.pin1identifierindicatessolder-bumpcomposition(1=snpb,
⋅
=铅-自由).
pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsoftexas
instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
nanostar,nanofreearetrademarksoftexasinstruments.
productiondatainformationiscurrentasofpublicationdate.
copyright©2004–2005,texasinstrumentsincorporated
ProductsconformtospecificationsperthetermsoftheTexas
instrumentsstandardwarranty.productionprocessingdoesnot
necessarilyincludetestingofallparameters.
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