www.ti.com
特点
dct 或 dcu p组件
(top 查看)
1
2
3
4
8
7
6
5
1A
1B
2Y
地
v
抄送
1Y
2B
2A
4
3
2
1
5
6
7
8
地
2Y
1B
1A
2A
2B
1Y
v
抄送
yep 或 yzp p组件
(bottom 查看)
描述/orderinginformation
SN74LVC2G132
dual2-inputnandgate
withschmitt-triggerinputs
SCES547A–FEBRUARY2004–REVISEDJUNE2005
•
AvailableinTexasInstrumentsNanoStar™
andNanoFree™Packages
•
supports5-vv
抄送
操作
•
inputsacceptvoltagesto5.5v
•
maxt
pd
of5.3nsat3.3v
•
低功耗,10-
µ
AMaxI
抄送
•±
24-maoutputdriveat3.3v
•
TypicalV
olp
(outputgroundbounce)&指示灯;0.8v
atV
抄送
=3.3v,t
一个
=25°C
•
TypicalV
OHV
(outputv
哦
下冲)>2vat
v
抄送
=3.3v,t
一个
=25°C
•
我
关
supportspartial-电源-downmode
操作
•
门闩-upperformanceexceeds100maper
jesd78,classii
•
ESDProtectionExceedsJESD22
–2000-vhuman-bodymodel(a114-一个)
–200-vmachinemodel(a115-一个)
–1000-vcharged-devicemodel(c101)
thisdual2-inputnandgatewithschmitt-triggerinputsisdesignedfor1.65-vto5.5-vv
抄送
操作.
TheSN74LVC2G132containstwoinvertersandperformstheBooleanfunctionY=A
⋅
BorY=A+Binpositive
逻辑.thedevicefunctionsastwoindependentinverters,butbecauseofschmittaction,ithasdifferentinput
thresholdlevelsforpositive-继续(v
T+
)andnegative-继续(v
t-
)信号.
nanostar™andnanofree™packagetechnologyisamajorbreakthroughinicpackagingconcepts,使用
dieasthepackage.
thisdevicecanbetriggeredfromtheslowestofinputrampsandstillgivecleanjitter-freeoutputsignals.
ORDERINGINFORMATION
t
一个
包装
(1)
orderablepartnumbertop-sidemarking
(2)
nanostar™–wcsp(dsbga)
SN74LVC2G132YEPR
0.23-mmlargebump–yep
reelof3000___d5_
nanofree™–wcsp(dsbga)
0.23-mmlargebump–yzpsn74lvc2g132yzpr
–40°Cto85°C
(铅-免费)
ssop–dctreelof3000sn74lvc2g132dctrc3b___
Reelof3000SN74LVC2G132DCUR
vssop–dcuc3b_
Reelof250SN74LVC2G132DCUT
(1)packagedrawings,标准包装数量,thermaldata,符号化,andpcbdesignguidelinesareavailableat
www.ti.com/sc/包装.
(2)dct:theactualtop-sidemarkinghasthreeadditionalcharactersthatdesignatetheyear,月份,andassembly/testsite.
dcu:theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatestheassembly/testsite.
yep/yzp:theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,月份,andsequencecode,andonefollowing
charactertodesignatetheassembly/testsite.pin1identifierindicatessolder-bumpcomposition(1=snpb,
⋅
=铅-免费).
pleasebeawarethatanimportantnoticeconcerningavailability,标准保修,anduseincriticalapplicationsoftexas
instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
nanostar,nanofreearetrademarksoftexasinstruments.
productiondatainformationiscurrentasofpublicationdate.
copyright©2004–2005,texasinstrumentsincorporated
ProductsconformtospecificationsperthetermsoftheTexas
instrumentsstandardwarranty.productionprocessingdoesnot
必要包括测试所有参数.
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