www.ti.com
特点
dbv 或 dck p组件
(top 查看)
1
2
3
5
4
d
clk
地
v
抄送
q
3
2
1
4
5
地
clk
d
q
v
抄送
yea, yep, yza, 或 yzp p组件
(bottom 查看)
描述/orderinginformation
SN74LVC1G80
singlepositive-边缘-triggeredd-typeflip-翻牌圈
SCES221O–APRIL1999–REVISEDJUNE2005
•
AvailableintheTexasInstruments
NanoStar™andNanoFree™Packages
•
supports5-vv
抄送
操作
•
inputsacceptvoltagesto5.5v
•
maxt
pd
of4.2nsat3.3v
•
低功耗,10-
µ
AMaxI
抄送
•±
24-maoutputdriveat3.3v
•
我
关
supportspartial-电源-downmode
操作
•
门闩-upperformanceexceeds100maper
jesd78,classii
•
ESDProtectionExceedsJESD22
–2000-vhuman-bodymodel(a114-一个)
–200-vmachinemodel(a115-一个)
–1000-vcharged-devicemodel(c101)
thissinglepositive-边缘-triggeredd-typeflip-flopisdesignedfor1.65-vto5.5-vv
抄送
操作.
whendataatthedata(d)inputmeetsthesetuptimerequirement,thedataistransferredtotheqoutputonthe
正-goingedgeoftheclockpulse.clocktriggeringoccursatavoltagelevelandisnotdirectlyrelatedtothe
risetimeoftheclockpulse.followingthehold-timeinterval,dataatthedinputcanbechangedwithoutaffecting
thelevelattheoutput.
nanostar™andnanofree™packagetechnologyisamajorbreakthroughinicpackagingconcepts,使用
dieasthepackage.
thisdeviceisfullyspecifiedforpartial-电源-downapplicationsusingi
关
.thei
关
circuitrydisablestheoutputs,
preventingdamagingcurrentbackflowthroughthedevicewhenitispowereddown.
ORDERINGINFORMATION
t
一个
包装
(1)
orderablepartnumbertop-sidemarking
(2)
nanostar™–wcsp(dsbga)
SN74LVC1G80YEAR
0.17-mmsmallbump–yea
nanofree™–wcsp(dsbga)
SN74LVC1G80YZAR
0.17-mmsmallbump–yza(铅-免费)
reelof3000___cx_
nanostar™–wcsp(dsbga)
SN74LVC1G80YEPR
0.23-mmlargebump–yep
–40°Cto85°C
nanofree™–wcsp(dsbga)
SN74LVC1G80YZPR
0.23-mmlargebump–yzp(铅-免费)
Reelof3000SN74LVC1G80DBVR
sot(sot-23)–dbvc80_
Reelof250SN74LVC1G80DBVT
Reelof3000SN74LVC1G80DCKR
sot(sc-70)–dckcx_
Reelof250SN74LVC1G80DCKT
(1)packagedrawings,标准包装数量,thermaldata,符号化,andpcbdesignguidelinesareavailableat
www.ti.com/sc/包装.
(2)dbv/dck:theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatestheassembly/testsite.
yea/yza,yep/yzp:theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,月份,andsequencecode,andone
followingcharactertodesignatetheassembly/testsite.pin1identifierindicatessolder-bumpcomposition(1=snpb,
•
=铅-免费).
pleasebeawarethatanimportantnoticeconcerningavailability,标准保修,anduseincriticalapplicationsoftexas
instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
nanostar,nanofreearetrademarksoftexasinstruments.
productiondatainformationiscurrentasofpublicationdate.
copyright©1999–2005,texasinstrumentsincorporated
ProductsconformtospecificationsperthetermsoftheTexas
instrumentsstandardwarranty.productionprocessingdoesnot
必要包括测试所有参数.
: 点此下载
