www.德州仪器.com
特性
dct 或者 dcu pACKAGE
(t运算 视图)
1
2
3
4
8
7
6
5
1CLK
1D
2Q
地
V
CC
1Q
2D
2CLK
4
3
2
1
5
6
7
8
地
2Q
1D
1CLK
2CLK
2D
1Q
V
CC
yep 或者 yzp pACKAGE
(bottom 视图)
描述/orderinginformation
SN74LVC2G80
dualpositive-边缘-triggeredd-typeflip-flop
SCES309C–DECEMBER2001–REVISEDJUNE2005
•
AvailableintheTexasInstruments
NanoStar™andNanoFree™Packages
•
supports5-vv
CC
运作
•
inputsacceptvoltagesto5.5v
•
Maxt
pd
of4.2nsat3.3v
•
lowpowerconsumption,10-
µ
AMaxI
CC
•
TypicalV
OLP
(outputgroundbounce)
<0.8vatv
CC
=3.3v,t
一个
=25°C
•
TypicalV
OHV
(outputv
OH
undershoot)
>2vatv
CC
=3.3v,t
一个
=25°C
•
I
止
featuresupportspartial-电源-向下
ModeOperation
•
获得-upperformanceexceeds100ma
perjesd78,classii
•
ESDProtectionExceedsJESD22
–2000-vhuman-bodymodel(a114-一个)
–200-vmachinemodel(a115-一个)
–1000-vcharged-devicemodel(c101)
thisdualpositive-边缘-triggeredd-typeflip-flopisdesignedfor1.65-vto5.5-vv
CC
运作.
whendataatthedata(d)inputmeetsthesetuptimerequirement,thedataistransferredtotheqoutputonthe
积极的-goingedgeoftheclockpulse.clocktriggeringoccursatavoltagelevelandisnotdirectlyrelatedtothe
risetimeoftheclockpulse.followingthehold-timeinterval,dataatthedinputcanbechangedwithoutaffecting
thelevelsattheoutputs.
nanostar™andnanofree™packagetechnologyisamajorbreakthroughinicpackagingconcepts,usingthe
dieasthepackage.
thisdeviceisfullyspecifiedforpartial-电源-downapplicationsusingi
止
.thei
止
circuitrydisablestheoutputs,
preventingdamagingcurrentbackflowthroughthedevicewhenitispowereddown.
ORDERINGINFORMATION
T
一个
包装
(1)
orderablepartnumbertop-sidemarking
(2)
nanostar™–wcsp(dsbga)
SN74LVC2G80YEPR
0.23-mmlargebump–yep
tapeandreel___cx_
nanofree™–wcsp(dsbga)
SN74LVC2G80YZPR
–40°Cto85°C
0.23-mmlargebump–yzp(铅-自由)
ssop–dcttapeandreelsn74lvc2g80dctrc80___
vssop–dcutapeandreelsn74lvc2g80dcurc80_
(1)packagedrawings,standardpackingquantities,thermaldata,符号化,andpcbdesignguidelinesareavailableat
www.德州仪器.com/sc/包装.
(2)dct:theactualtop-sidemarkinghasthreeadditionalcharactersthatdesignatetheyear,month,andassembly/testsite.
dcu:theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatestheassembly/testsite.
yep/yzp:theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,month,andsequencecode,andonefollowing
charactertodesignatetheassembly/testsite.pin1identifierindicatessolder-bumpcomposition(1=snpb,
⋅
=铅-自由).
pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsoftexas
instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
nanostar,nanofreearetrademarksoftexasinstruments.
productiondatainformationiscurrentasofpublicationdate.
copyright©2001–2005,texasinstrumentsincorporated
ProductsconformtospecificationsperthetermsoftheTexas
instrumentsstandardwarranty.productionprocessingdoesnot
necessarilyincludetestingofallparameters.
: 点此下载
