www.ti.com
特点
dct 或 dcu p组件
(top 查看)
1
2
3
4
8
7
6
5
1A
1B
2C
地
v
抄送
1C
2B
2A
4
3
2
1
5
6
7
8
地
2C
1B
1A
2A
2B
1C
v
抄送
yea, yep, yza, 或 yzp p组件
(bottom 查看)
描述/orderinginformation
SN74LVC2G66
DUALBILATERALANALOGSWITCH
SCES325H–JULY2001–REVISEDJULY2005
•
AvailableintheTexasInstruments
NanoStar™andNanoFree™Packages
•
1.65-vto5.5-vv
抄送
操作
•
inputsacceptvoltagesto5.5v
•
maxt
pd
of0.8nsat3.3v
•
highon-offoutputvoltageratio
•
HighDegreeofLinearity
•
highspeed,typically0.5ns
(v
抄送
=3v,c
l
=50pf)
•
轨道-至-railinput/输出
•
lowon-stateresistance,通常
≈
6
Ω
(v
抄送
=4.5v)
•
门闩-upperformanceexceeds100maper
jesd78,classii
thisdualbilateralanalogswitchisdesignedfor1.65-vto5.5-vv
抄送
操作.
thesn74lvc2g66canhandlebothanaloganddigitalsignals.thedevicepermitssignalswithamplitudesofup
to5.5v(峰值)tobetransmittedineitherdirection.
nanostar™andnanofree™packagetechnologyisamajorbreakthroughinicpackagingconcepts,使用
dieasthepackage.
eachswitchsectionhasitsownenable-inputcontrol(c).ahigh-levelvoltageappliedtocturnsonthe
associatedswitchsection.
applicationsincludesignalgating,切碎,modulationordemodulation(调制解调器),andsignalmultiplexingfor
模拟-至-digitalanddigital-至-analogconversionsystems.
ORDERINGINFORMATION
t
一个
包装
(1)
orderablepartnumbertop-sidemarking
(2)
nanostar™–wcsp(dsbga)
SN74LVC2G66YEAR
0.17-mmsmallbump–yea
nanofree™–wcsp(dsbga)
SN74LVC2G66YZAR
0.17-mmsmallbump–yza(铅-免费)
reelof3000___c6_
nanostar™–wcsp(dsbga)
SN74LVC2G66YEPR
0.23-mmlargebump–yep
–40°Cto85°C
nanofree™–wcsp(dsbga)
SN74LVC2G66YZPR
0.23-mmlargebump–yzp(铅-免费)
ssop–dctreelof3000sn74lvc2g66dctrc66___
Reelof3000SN74LVC2G66DCUR
vssop–dcuc66_
Reelof250SN74LVC2G66DCUT
(1)packagedrawings,标准包装数量,thermaldata,符号化,andpcbdesignguidelinesareavailableat
www.ti.com/sc/包装.
(2)dct:theactualtop-sidemarkinghasthreeadditionalcharactersthatdesignatetheyear,月份,andassembly/testsite.
dcu:theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatestheassembly/testsite.
yea/yza,yep/yzp:theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,月份,andsequencecode,andone
followingcharactertodesignatetheassembly/testsite.pin1identifierindicatessolder-bumpcomposition(1=snpb,
•
=铅-免费).
pleasebeawarethatanimportantnoticeconcerningavailability,标准保修,anduseincriticalapplicationsoftexas
instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
nanostar,nanofreearetrademarksoftexasinstruments.
productiondatainformationiscurrentasofpublicationdate.
copyright©2001–2005,texasinstrumentsincorporated
ProductsconformtospecificationsperthetermsoftheTexas
instrumentsstandardwarranty.productionprocessingdoesnot
必要包括测试所有参数.
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