3volt英特尔
®
Advanced+BootBlock
FlashMemory(c3)堆叠式-chipScale
Package家庭
数据表
Product特点
The3Volt英特尔
®
Advanced+BootBlockFlashMemory(c3)堆叠式-chipScalePackage
(堆叠式-csp)devicedeliversa功能-richsolutionfor低-power应用程序.TheC3
堆叠式-cspmemorydeviceincorporatesflashmemoryandstaticRAMinonepackagewith
lowvoltagecapabilitytoachievethesmallestsystemmemorysolution窗体-factortogetherwith
高速,低-power运营.TheC3堆叠式-cspmemorydeviceoffersaprotection
registerandflexibleblocklockingtoenablenextgenerationsecurity能力.Combinedwith
the英特尔
®
FlashDataIntegrator(英特尔
®
fdi)软件,theC3堆叠式-cspmemorydevice
providesa成本效益,灵活,codeplusdatastorage解决方案.
■
FlashMemoryPlusSRAM
—ReducesMemoryBoardSpace
必填项,SimplifyingPCBDesign
复杂性
■
堆叠式-chipScalePackage(堆叠式-
csp)技术
—SmallestMemorySubsystem占地面积
—Area:8x10mmfor16Mbit(0.13µm)
Flash+2Mbitor4MbitSRAM
—Area:8x12mmfor32Mbit(0.13µm)
Flash+4Mbitor8MbitSRAM
—Height:1.20mmfor16Mbit(0.13µm)
Flash+2Mbitor4MbitSRAMand
32Mbit(0.13um)Flash+8MbitSRAM
—Height:1.40mmfor32Mbit(0.13µm)
Flash+4MbitSRAM
—ThisFamilyalsoincludes0.25µmand
0.18µm技术
■
AdvancedSRAMTechnology
—70nsAccess时间
—LowPower操作
—LowVoltageDataRetention模式
■
英特尔
®
FlashDataIntegrator(fdi)
软件
—真实-timeDataStorageandCode
ExecutionintheSameMemory设备
—FullFlashFileManager能力
■
Advanced+BootBlockFlash记忆
—70nsAccessTimeat2.7v
—即时,individualBlock锁定
—128bitProtectionRegister
—12VProduction编程
—UltraFastProgramandErase挂起
—ExtendedTemperature–25°Cto+85°C
■
Blocking体系结构
—BlockSizesforCode+Data存储
—4-kwordParameterBlocks(fordata)
—64-kbyteMainBlocks(for代码)
—100,000EraseCyclesperBlock
■
LowPower操作
—AsyncRead电流:9mA(闪光灯)
—Standby电流:7µA(闪光灯)
—AutomaticPowerSaving模式
■
Flash技术
—0.25µmETOX™六,0.18µmETOX™
VIIand0.13µmETOX™VIIIFlash
Technologies
—28f160xc3,28F320xC3
252636-001
二月,2003
通知:
Thisdocumentcontainsinformationonnewproductsin生产.Thespecifications
aresubjecttochangewithout通知.VerifywithyourlocalIntelsalesofficethatyouhavethelat-
estdatasheetbeforefinalizinga设计.