www.ti.com
特点
dct 或 dcu p组件
(top 查看)
1
2
3
4
8
7
6
5
1CLK
1D
2Q
地
v
抄送
1Q
2D
2CLK
4
3
2
1
5
6
7
8
地
2Q
1D
1CLK
2CLK
2D
1Q
v
抄送
yep 或 yzp p组件
(bottom 查看)
描述/orderinginformation
SN74LVC2G80
dualpositive-边缘-triggeredd-typeflip-翻牌圈
SCES309C–DECEMBER2001–REVISEDJUNE2005
•
AvailableintheTexasInstruments
NanoStar™andNanoFree™Packages
•
supports5-vv
抄送
操作
•
inputsacceptvoltagesto5.5v
•
maxt
pd
of4.2nsat3.3v
•
低功耗,10-
µ
AMaxI
抄送
•
TypicalV
olp
(outputgroundbounce)
&指示灯;0.8vatv
抄送
=3.3v,t
一个
=25°C
•
TypicalV
OHV
(outputv
哦
下冲)
>2vatv
抄送
=3.3v,t
一个
=25°C
•
我
关
featuresupportspartial-电源-向下
ModeOperation
•
门闩-upperformanceexceeds100ma
perjesd78,classii
•
ESDProtectionExceedsJESD22
–2000-vhuman-bodymodel(a114-一个)
–200-vmachinemodel(a115-一个)
–1000-vcharged-devicemodel(c101)
thisdualpositive-边缘-triggeredd-typeflip-flopisdesignedfor1.65-vto5.5-vv
抄送
操作.
whendataatthedata(d)inputmeetsthesetuptimerequirement,thedataistransferredtotheqoutputonthe
正-goingedgeoftheclockpulse.clocktriggeringoccursatavoltagelevelandisnotdirectlyrelatedtothe
risetimeoftheclockpulse.followingthehold-timeinterval,dataatthedinputcanbechangedwithoutaffecting
thelevelsattheoutputs.
nanostar™andnanofree™packagetechnologyisamajorbreakthroughinicpackagingconcepts,使用
dieasthepackage.
thisdeviceisfullyspecifiedforpartial-电源-downapplicationsusingi
关
.thei
关
circuitrydisablestheoutputs,
preventingdamagingcurrentbackflowthroughthedevicewhenitispowereddown.
ORDERINGINFORMATION
t
一个
包装
(1)
orderablepartnumbertop-sidemarking
(2)
nanostar™–wcsp(dsbga)
SN74LVC2G80YEPR
0.23-mmlargebump–yep
tapeandreel___cx_
nanofree™–wcsp(dsbga)
SN74LVC2G80YZPR
–40°Cto85°C
0.23-mmlargebump–yzp(铅-免费)
ssop–dcttapeandreelsn74lvc2g80dctrc80___
vssop–dcutapeandreelsn74lvc2g80dcurc80_
(1)packagedrawings,标准包装数量,thermaldata,符号化,andpcbdesignguidelinesareavailableat
www.ti.com/sc/包装.
(2)dct:theactualtop-sidemarkinghasthreeadditionalcharactersthatdesignatetheyear,月份,andassembly/testsite.
dcu:theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatestheassembly/testsite.
yep/yzp:theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,月份,andsequencecode,andonefollowing
charactertodesignatetheassembly/testsite.pin1identifierindicatessolder-bumpcomposition(1=snpb,
⋅
=铅-免费).
pleasebeawarethatanimportantnoticeconcerningavailability,标准保修,anduseincriticalapplicationsoftexas
instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
nanostar,nanofreearetrademarksoftexasinstruments.
productiondatainformationiscurrentasofpublicationdate.
copyright©2001–2005,texasinstrumentsincorporated
ProductsconformtospecificationsperthetermsoftheTexas
instrumentsstandardwarranty.productionprocessingdoesnot
必要包括测试所有参数.
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