©2002 仙童 半导体 公司 rev. b, january 2002
isl9n310ap3/isl9n310as3st/isl9n310as3
额外的刺激 热的模型
rev 23 将 2001
ISL9N310T
ctherm1 th 6 1.0e-3
ctherm2 6 5 3.5e-3
ctherm3 5 4 4.8e-3
ctherm4 4 3 5.2e-3
ctherm5 3 2 8.0e-3
ctherm6 2 tl 3.7e-2
rtherm1 th 6 1e-2
rtherm2 6 5 9e-2
rtherm3 5 4 1.1e-1
rtherm4 4 3 4.0e-1
rtherm5 3 2 5.0e-1
rtherm6 2 tl 5.6e-1
saber 热的模型
saber 热的 模型 isl9n310t
template 热的_模型 th tl
热的_c th, tl
{
ctherm.ctherm1 th 6 = 1.0e-3
ctherm.ctherm2 6 5 = 3.5e-3
ctherm.ctherm3 5 4 = 4.8e-3
ctherm.ctherm4 4 3 = 5.2e-3
ctherm.ctherm5 3 2 = 8.0e-3
ctherm.ctherm6 2 tl = 3.7e-2
rtherm.rtherm1 th 6 = 1e-2
rtherm.rtherm2 6 5 = 9e-2
rtherm.rtherm3 5 4 = 1.1e-1
rtherm.rtherm4 4 3 = 4.0e-1
rtherm.rtherm5 3 2 = 5.0e-1
rtherm.rtherm6 2 tl = 5.6e-1
}
RTHERM4
RTHERM6
RTHERM5
RTHERM3
RTHERM2
RTHERM1
CTHERM4
CTHERM6
CTHERM5
CTHERM3
CTHERM2
CTHERM1
tl
2
3
4
5
6
th
接合面
情况