ATJ2085_集成电路资料查询网

atj2085                                  数据 薄板                       actions
版权 © 2004 actions 半导体 co., 有限公司. 所有 权利 保留.
ver 1.5 页 3 8/18/2004
4.2 交流 测试 输出 测量 点 .....................................................................................22
4.3 重置 参数 .............................................................................................................22
4.4 initialization 参数....................................................................................................22
4.5 gpio 接口 参数...............................................................................................23
4.6 ordinary 只读存储器 参数 ...............................................................................................23
4.7 外部 系统 总线 参数 .....................................................................................24
4.8 总线 运作..................................................................................................................25
4.9 一个/d 转换器特性.........................................................................................27
4.10 headphone 驱动器 特性 表格.......................................................................27
4.11 lcm 驱动器 参数...................................................................................................29
mcu/dsp 消耗 (ivdd vs. frequency)....................................................................................30
1 mcu 消耗 ........................................................................................................................30
2 dsp 消耗.........................................................................................................................30
推荐 soldering conditions .................................................................................................31
1 焊接 情况..................................................................................................................31
2 precaution 相反 静电释放 为 半导体 ............................................................................31
3 处理 的 unused 输入 管脚 为 cmos.................................................................................31
4 状态 在之前 initialization 的 mos 设备 ..............................................................................32
包装Drawings ..............................................................................................................................33
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atj2085 数据薄板 actions 版权 © 2004 actions 半导体 co., 有限公司. 所有权利保留. ver 1.5 页 3 8/18/2004 5.4.2 交流测试输出测量点 .....................................................................................22 5.4.3 重置参数 .............................................................................................................22 5.4.4 initialization 参数....................................................................................................22 5.4.5 gpio 接口参数...............................................................................................23 5.4.6 ordinary 只读存储器参数 ...............................................................................................23 5.4.7 外部系统总线参数 .....................................................................................24 5.4.8 总线运作..................................................................................................................25 5.4.9 一个/d 转换器特性.........................................................................................27 5.4.10 headphone 驱动器特性表格.......................................................................27 5.4.11 lcm 驱动器参数...................................................................................................29 6. mcu/dsp 消耗 (ivdd vs. frequency)....................................................................................30 6.1 mcu 消耗 ........................................................................................................................30 6.2 dsp 消耗.........................................................................................................................30 7. 推荐 soldering conditions .................................................................................................31 7.1 焊接情况..................................................................................................................31 7.2 precaution 相反静电释放为半导体 ............................................................................31 7.3 处理的 unused 输入管脚为 cmos.................................................................................31 7.4 状态在之前 initialization 的 mos 设备 ..............................................................................32 8. 包装Drawings ..............................................................................................................................33 www.mp3js.com.cn

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