©2002 仙童 半导体 公司 fdp038an06a0 / fdi038an06a0 rev. a1
fdp038an06a0 / fdi038an06a0
pspice 热的 模型
rev 23 july 4, 2002
FDP038AN06A0T
ctherm1 th 6 6.45e-3
ctherm2 6 5 3e-2
ctherm3 5 4 1.4e-2
ctherm4 4 3 1.65e-2
ctherm5 3 2 4.85e-2
ctherm6 2 tl 1e-1
rtherm1 th 6 3.24e-3
rtherm2 6 5 8.08e-3
rtherm3 5 4 2.28e-2
rtherm4 4 3 1e-1
rtherm5 3 2 1.1e-1
rtherm6 2 tl 1.4e-1
saber 热的 模型
saber 热的 模型 fdp035an06a0t
template 热的_模型 th tl
热的_c th, tl
{
ctherm.ctherm1 th 6 =6.45e-3
ctherm.ctherm2 6 5 =3e-2
ctherm.ctherm3 5 4 =1.4e-2
ctherm.ctherm4 4 3 =1.65e-2
ctherm.ctherm5 3 2 =4.85e-2
ctherm.ctherm6 2 tl =1e-1
rtherm.rtherm1 th 6 =3.24e-3
rtherm.rtherm2 6 5 =8.08e-3
rtherm.rtherm3 5 4 =2.28e-2
rtherm.rtherm4 4 3 =1e-1
rtherm.rtherm5 3 2 =1.1e-1
rtherm.rtherm6 2 tl=1.4e-1
}
RTHERM4
RTHERM6
RTHERM5
RTHERM3
RTHERM2
RTHERM1
CTHERM4
CTHERM6
CTHERM5
CTHERM3
CTHERM2
CTHERM1
tl
2
3
4
5
6
th
接合面
情况