smsc ds – lpc47m192 页 6 rev. 03/30/05
数据手册
7.18.3.7
相似物 电压度量....................................................................................................................... 135
7.18.3.8
电压 id..................................................................................................................................................... 135
7.18.3.9
温度 measurement............................................................................................................................ 135
7.18.3.10
热的 / 电压中断 管脚 .................................................................................................................... 136
7.18.3.11
输入 safety................................................................................................................................................... 137
7.18.3.12
布局 considerations .................................................................................................................................. 137
8
runtime reGISTERS .....................................................................................................................139
9
配置 .............................................................................................................................166
9.1
S
YSTEM
E
LEMENTS
........................................................................................................................166
9.1.1
primary configuration 地址解码器 ..............................................................................................166
9.1.1.1
进去 这 configuration 状态................................................................................................................... 166
9.1.1.2
exiting 这 configuration 状态..................................................................................................................... 166
9.2
C
ONFIGURATION
S
EQUENCE
...........................................................................................................167
9.2.1
enter configuration模式.....................................................................................................................167
9.2.1.1
Configuration 模式 ...................................................................................................................................... 167
9.2.2
exit configuration模式 .......................................................................................................................167
9.2.2.1
程序编制例子.................................................................................................................................. 167
9.3
C
HIP
L
EVEL
(g
LOBAL
)
C
ONTROL
/c
ONFIGURATION
R
EGISTERS
[0
X
00-0
X
2F].....................................170
9.4
L
OGICAL
D
EVICE
C
ONFIGURATION
/c
ONTROL
R
EGISTERS
[0
X
30-0
X
ff].............................................173
9.5
SMSC
D
EFINED
L
OGICAL
D
EVICE
C
ONFIGURATION
R
EGISTERS
.......................................................178
10
寄存器 为 硬件MONITORING块 ..............................................................184
10.1
R
EGISTER
S
UMMARY
...................................................................................................................184
10.2
I
NTERNAL
一个
DDRESS
R
EGISTER
....................................................................................................184
10.3
V
alue 或者
L
IMIT
R
EGISTERS
(15
H
-3d
H
) .......................................................................................184
10.3.1.1
寄存器3eh-4fh......................................................................................................................................... 186
11
运算的 deSCRIPTIOn.....................................................................................................190
11.1
M
AXIMUM
G
UARANTEED
R
ATINGS
................................................................................................190
11.1.1
超级的 i/o 部分 (pins 1 至100).......................................................................................................190
11.1.2
硬件 monitoring block (管脚 101 至128) ...................................................................................190
11.2
H
ARDWARE
M
ONITORING
B
锁
S
PECIFICATIONS
........................................................................190
11.2.1
关键 specifications.............................................................................................................................190
11.2.2
供应Current ..................................................................................................................................190
11.2.3
运行 temperature.....................................................................................................................190
11.2.4
运行 voltage ratings ................................................................................................................190
11.3
直流
E
LECTRICAL
C
HARACTERISTICS
.............................................................................................191
11.3.1
电容 values 为管脚..............................................................................................................196
12
定时 diAGRAMS .......................................................................................................................197
13
包装外形......................................................................................................................220
14
附录 一个 – 热的二极管 para计量表......................................................................221
15
附录 b – 模数转换器 voltage 变换器SION...........................................................................222
16
附录 c -测试 模式 ..........................................................................................................223
16.1
S
UPER
i/o
B
锁
.......................................................................................................................223
16.1.1
板 测试模式...............................................................................................................................223
16.2
H
ARDWARE
M
ONITORING
B
锁
.................................................................................................225
16.2.1
板 测试模式...............................................................................................................................225
16.2.2
xnor-chain测试模式 ...................................................................................................................225
17
附录 d - reference documents.................................................................................227
18
lpc47m192 revisions................................................................................................................228
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