SSM2211_集成电路资料查询网

SSM2211

rev. d | 页 2 的 24

表格的内容

特性 .............................................................................................. 1

产品....................................................................................... 1

函数的块图解 .............................................................. 1

一般描述......................................................................... 1

修订 history ............................................................................... 2

电的特性 ................................................................. 3

绝对最大比率............................................................ 5

热的阻抗 ...................................................................... 5

静电释放提醒.................................................................................. 5

管脚配置和函数描述 ........................... 6

典型效能特性 ............................................. 7

产品 overview........................................................................... 14

热的 performance—lfcsp................................................ 14

典型产品....................................................................... 15

bridged 输出 vs. 单独的-结束输出配置 ... 15

扬声器效率和 loudness............................................. 15

电源消耗....................................................................... 16

输出电压头上空间........................................................ 17

自动关闭-感觉到电路..................................... 17

关闭-电路设计例子 ......................................... 18

开始-向上 popping 噪音............................................................. 18

ssm2211 放大器设计例子 .................................. 18

单独的-结束产品........................................................ 19

驱动二扬声器单独的 endedly..................................... 19

evaluation 板........................................................................ 20

lfcsp 打印电路板布局仔细考虑 .......... 20

外形维度....................................................................... 21

订货手册 .......................................................................... 21

修订 history

11/06—rev. c 至 rev. d

updated format..................................................................普遍的

改变至一般描述 .................................................... 1

改变至电的特性 ............................................ 3

改变至绝对最大比率....................................... 5

增加表格 6.................................................................................... 6

改变至图示 32...................................................................... 11

改变至这产品 overview 部分 ................................. 14

改变至这输出电压头上空间部分................... 17

改变至这开始-向上 popping 噪音部分........................ 18

改变至这 evaluation 板部分 ................................... 20

updated 外形维度....................................................... 21

改变至订货手册 .......................................................... 21

10/04—data 薄板 changed 从 rev. b 至 rev. c

updated format..................................................................普遍的

改变至一般描述 .................................................... 1

改变至表格 5............................................................................ 4

deleted 热的 performance—soic 部分 ........................... 8

改变至图示 31...................................................................... 10

改变至图示 40...................................................................... 12

改变至热的 performance—lfcsp 部分 ................. 13

deleted 图示 52, renumbered successive 计算数量.................. 14

deleted 打印电路板 layout—soic 部分 ............. 14

改变至输出电压头上空间部分 ......................... 16

改变至开始-向上 popping 噪音部分 .............................. 17

改变至订货手册 .......................................................... 20

10/02—data 薄板 changed 从 rev. 一个至 rev. b

deleted 8-含铅的 pdip .........................................................普遍的

updated 外形维度....................................................... 15

5/02—data 薄板 changed 从 rev. 0 至 rev. 一个

edits 至一般描述 ...........................................................1

edits 至包装类型 .......................................................................3

edits 至订货手册 ...................................................................3

edits 至产品 overview...............................................................8

edits 至打印电路板布局仔细考虑 ............. 13

增加部分打印电路板布局

Considerations—LFCSP................................................................ 14

标　题:
内　容:
用户名:

手机号:	(*未登录用户需填写手机号,手机号不公开,可用于网站积分.)

本平台电子爱好着纯手工中文简译:	截至2020/5/17日,支持英文词汇500个

SSM2211 rev. d \| 页 2 的 24 表格的内容特性 .............................................................................................. 1 产品....................................................................................... 1 函数的块图解 .............................................................. 1 一般描述......................................................................... 1 修订 history ............................................................................... 2 电的特性 ................................................................. 3 绝对最大比率............................................................ 5 热的阻抗 ...................................................................... 5 静电释放提醒.................................................................................. 5 管脚配置和函数描述 ........................... 6 典型效能特性 ............................................. 7 产品 overview........................................................................... 14 热的 performance—lfcsp................................................ 14 典型产品....................................................................... 15 bridged 输出 vs. 单独的-结束输出配置 ... 15 扬声器效率和 loudness............................................. 15 电源消耗....................................................................... 16 输出电压头上空间........................................................ 17 自动关闭-感觉到电路..................................... 17 关闭-电路设计例子 ......................................... 18 开始-向上 popping 噪音............................................................. 18 ssm2211 放大器设计例子 .................................. 18 单独的-结束产品........................................................ 19 驱动二扬声器单独的 endedly..................................... 19 evaluation 板........................................................................ 20 lfcsp 打印电路板布局仔细考虑 .......... 20 外形维度....................................................................... 21 订货手册 .......................................................................... 21 修订 history 11/06—rev. c 至 rev. d updated format..................................................................普遍的改变至一般描述 .................................................... 1 改变至电的特性 ............................................ 3 改变至绝对最大比率....................................... 5 增加表格 6.................................................................................... 6 改变至图示 32...................................................................... 11 改变至这产品 overview 部分 ................................. 14 改变至这输出电压头上空间部分................... 17 改变至这开始-向上 popping 噪音部分........................ 18 改变至这 evaluation 板部分 ................................... 20 updated 外形维度....................................................... 21 改变至订货手册 .......................................................... 21 10/04—data 薄板 changed 从 rev. b 至 rev. c updated format..................................................................普遍的改变至一般描述 .................................................... 1 改变至表格 5............................................................................ 4 deleted 热的 performance—soic 部分 ........................... 8 改变至图示 31...................................................................... 10 改变至图示 40...................................................................... 12 改变至热的 performance—lfcsp 部分 ................. 13 deleted 图示 52, renumbered successive 计算数量.................. 14 deleted 打印电路板 layout—soic 部分 ............. 14 改变至输出电压头上空间部分 ......................... 16 改变至开始-向上 popping 噪音部分 .............................. 17 改变至订货手册 .......................................................... 20 10/02—data 薄板 changed 从 rev. 一个至 rev. b deleted 8-含铅的 pdip .........................................................普遍的 updated 外形维度....................................................... 15 5/02—data 薄板 changed 从 rev. 0 至 rev. 一个 edits 至一般描述 ...........................................................1 edits 至包装类型 .......................................................................3 edits 至订货手册 ...................................................................3 edits 至产品 overview...............................................................8 edits 至打印电路板布局仔细考虑 ............. 13 增加部分打印电路板布局 Considerations—LFCSP................................................................ 14

	电话：13410210660 QQ : 84325569
	联系方式： E-mail:CaiZH01@163.com