状态 信息
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生产 信息
© cambridge 硅 无线电 限制 2005
页 4 的 102
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产品 数据 薄板
10.5.7
detach 和 wake-向上 signalling ................................................................................................ 69
10.5.8
usb driver ................................................................................................................................. 69
10.5.9
usb 1.1 compliance.................................................................................................................. 70
10.5.10
usb 2.0 竞赛atibility........................................................................................................... 70
10.6
串行 peripheral interface ..................................................................................................................... 70
10.6.1
Instructi在 循环......................................................................................................................... 70
10.6.2
writing 至 bluecore4-只读存储器 ........................................................................................................ 71
10.6.3
读 从 bluecore4-只读存储器 .................................................................................................. 71
10.6.4
multi 从动装置Operation................................................................................................................. 71
10.7
音频的 pcm 在terface ............................................................................................................................. 72
10.7.1
pcm 接口主控/slave ...................................................................................................... 73
10.7.2
长 frame sync....................................................................................................................... 74
10.7.3
短的 frame sync ...................................................................................................................... 74
10.7.4
multi slotOperation.................................................................................................................... 75
10.7.5
gci interface.............................................................................................................................. 75
10.7.6
slots 和 sample formats......................................................................................................... 76
10.7.7
额外的Features .................................................................................................................... 76
10.7.8
pcm 定时 在formati在 ............................................................................................................ 77
10.7.9
pcm 从动装置定时 ..................................................................................................................... 79
10.7.10
pcm_clk 和 pcm_同步 gene限定.................................................................................. 81
10.7.11
pcm configuration................................................................................................................... 82
10.8
i/o 并行的端口 ................................................................................................................................... 83
10.8.1
pio defaults 为 btv2.0 + edr hci 水平的 bluetooth stack ....................................................... 83
10.9
I
2
c interface........................................................................................................................................... 84
10.10
tcxo 使能或者 function.................................................................................................................. 84
10.11
重置 和resetb........................................................................................................................... 85
10.11.1
管脚 states在 reset ................................................................................................................. 86
10.11.2
状态 after reset .................................................................................................................... 86
10.12
电源 supplies.................................................................................................................................... 87
10.12.1
供应 domains和 sequencing ............................................................................................ 87
10.12.2
外部 voltage source........................................................................................................... 87
10.12.3
直线的 regulator....................................................................................................................... 87
10.12.4
vreg_en管脚.......................................................................................................................... 87
11
应用图式................................................................................................................................. 88
12
包装 dimensions ................................................................................................................................... 89
12.1
6 x 6mm vfbga84-球 package......................................................................................................... 89
13
焊盘 profiles.............................................................................................................................................. 90
13.1
焊盘 re-流动 profile 为 devices 和 含铅的-free 焊盘Balls ........................................................... 90
14
订货 信息rmation ................................................................................................................................... 92
14.1
BlueCore4-只读存储器 .................................................................................................................................... 92
15
录音带 和 卷轴信息 .......................................................................................................................... 93
15.1
录音带 方向和 dimensions ......................................................................................................... 93
15.2
卷轴 信息rmation .................................................................................................................................... 95
15.3
dry 包装 信息rmation ............................................................................................................................. 96
15.4
baking conditions.................................................................................................................................. 97
15.5
产品 信息rmation ............................................................................................................................... 97
16
联系 信息rmation..................................................................................................................................... 98
17
文档 references ................................................................................................................................. 99
条款 和 definitions ...................................................................................................................................... 100
文档History ............................................................................................................................................. 102
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