©2002 仙童 半导体 公司 fdd10an06a0 rev. 一个
FDD10AN06A0
额外的刺激 热的 模型
rev 23 july 2002
FDD10AN06A0T
ctherm1 th 6 3.2e-3
ctherm2 6 5 3.3e-3
ctherm3 5 4 3.4e-3
ctherm4 4 3 3.5e-3
ctherm5 3 2 6.4e-3
ctherm6 2 tl 1.9e-2
rtherm1 th 6 5.5e-4
rtherm2 6 5 5.0e-3
rtherm3 5 4 4.5e-2
rtherm4 4 3 1.5e-1
rtherm5 3 2 3.37e-1
rtherm6 2 tl 3.5e-1
saber 热的 模型
saber 热的 模型 fdd10an06a0t
template 热的_模型 th tl
热的_c th, tl
{
ctherm.ctherm1 th 6 =3.2e-3
ctherm.ctherm2 6 5 =3.3e-3
ctherm.ctherm3 5 4 =3.4e-3
ctherm.ctherm4 4 3 =3.5e-3
ctherm.ctherm5 3 2 =6.4e-3
ctherm.ctherm6 2 tl =1.9e-2
rtherm.rtherm1 th 6 =5.5e-4
rtherm.rtherm2 6 5 =5.0e-3
rtherm.rtherm3 5 4 =4.5e-2
rtherm.rtherm4 4 3 =1.5e-1
rtherm.rtherm5 3 2 =3.37e-1
rtherm.rtherm6 2 tl =3.5e-1
}
RTHERM4
RTHERM6
RTHERM5
RTHERM3
RTHERM2
RTHERM1
CTHERM4
CTHERM6
CTHERM5
CTHERM3
CTHERM2
CTHERM1
tl
2
3
4
5
6
th
接合面
情况