©2002 仙童 半导体 公司 fdb060an08a0 / fdp060an08a0 rev. 一个
fdb060an08a0 / fdp060an08a0
pspice 热的 模型
rev 23 october 2002
FDP060AN08A0T
ctherm1 th 6 9.6e-3
ctherm2 6 5 9.7e-3
ctherm3 5 4 9.8e-3
ctherm4 4 3 1e-2
ctherm5 3 2 3e-2
ctherm6 2 tl 9e-2
rtherm1 th 6 3.2e-3
rtherm2 6 5 8.1e-3
rtherm3 5 4 2.3e-2
rtherm4 4 3 1.2e-1
rtherm5 3 2 1.5e-1
rtherm6 2 tl 1.6e-1
saber 热的 模型
saber 热的 模型 fdp060an08a0t
template 热的_模型 th tl
热的_c th, tl
{
ctherm.ctherm1 th 6 =9.6e-3
ctherm.ctherm2 6 5 =9.7e-3
ctherm.ctherm3 5 4 =9.8e-3
ctherm.ctherm4 4 3 =1e-2
ctherm.ctherm5 3 2 =3e-2
ctherm.ctherm6 2 tl =9e-2
rtherm.rtherm1 th 6 =3.2e-3
rtherm.rtherm2 6 5 =8.1e-3
rtherm.rtherm3 5 4 =2.3e-2
rtherm.rtherm4 4 3 =1.2e-1
rtherm.rtherm5 3 2 =1.5e-1
rtherm.rtherm6 2 tl =1.6e-1
}
RTHERM4
RTHERM6
RTHERM5
RTHERM3
RTHERM2
RTHERM1
CTHERM4
CTHERM6
CTHERM5
CTHERM3
CTHERM2
CTHERM1
tl
2
3
4
5
6
th
接合面
情况
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