©2002 仙童 半导体 公司 rev. b january 2002
ISL9N302AP3
额外的刺激 热的模型
rev 将 2001
TISL9N302AP3
ctherm1 th 6 4.5e-3
ctherm2 6 5 2e-2
ctherm3 5 4 1.5e-2
ctherm4 4 3 2.5e-2
ctherm5 3 2 7e-2
ctherm6 2 tl 2.5e-1
rtherm1 th 6 2e-3
rtherm2 6 5 8.5e-3
rtherm3 5 4 6e-2
rtherm4 4 3 8e-2
rtherm5 3 2 9e-2
rtherm6 2 tl 1e-1
saber 热的模型
saber 热的 模型 tisl9n302ap3
template 热的_模型 th tl
热的_c th, tl
{
ctherm.ctherm1 th 6 = 4.5e-3
ctherm.ctherm2 6 5 = 2e-2
ctherm.ctherm3 5 4 = 1.5e-2
ctherm.ctherm4 4 3 = 2.5e-2
ctherm.ctherm5 3 2 = 7e-2
ctherm.ctherm6 2 tl = 2.5e-1
rtherm.rtherm1 th 6 =2e-3
rtherm.rtherm2 6 5 = 8.5e-3
rtherm.rtherm3 5 4 = 6e-2
rtherm.rtherm4 4 3 = 8e-2
rtherm.rtherm5 3 2 = 9e-2
rtherm.rtherm6 2 tl = 1e-1
}
RTHERM4
RTHERM6
RTHERM5
RTHERM3
RTHERM2
RTHERM1
CTHERM4
CTHERM6
CTHERM5
CTHERM3
CTHERM2
CTHERM1
tl
2
3
4
5
6
th
接合面
情况
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