PEB 2255
falc-lh v1.3
表格 的 内容 页
数据 薄板 12 2000-07
8
.3.10 bitorientedmessagemode(t1/j1) .......................... 176
8
.3.10.1 datalinkaccessinesf/f72format(t1/j1) ................. 17
8
9E1Registers
.............................................. 1
8
0
9
.1 E1ControlRegisterAddresses ................................ 1
8
0
9
.2 DetailedDescriptionofE1ControlRegisters ..................... 1
8
3
9
.3 e1statusregisteraddresses................................. 22
8
9
.
4
DetailedDescriptionofE1StatusRegisters ...................... 230
10 t1/j1 寄存器
........................................... 25
8
10.1 t1/j1controlregisteraddresses.............................. 25
8
10.2 detaileddescriptionoft1/j1controlregisters ................... 261
10.3 t1/j1statusregisteraddresses .............................. 307
10.
4
detaileddescriptionoft1/j1statusregisters .................... 30
9
11 电的 特性
................................... 335
11.1 AbsoluteMaximumRatings ................................... 335
11.2 OperatingRange .......................................... 335
11.3 DCCharacteristics.......................................... 336
11.
4
ACCharacteristics .......................................... 33
9
11.
4
.1 推荐 Oscillator 电路 . . .......................... 33
9
11.
4
.2
X
TALClockTiming ....................................... 33
9
11.
4
.3 JTAG Boundary Scan 接口 .............................. 3
4
1
11.
4
.
4
重置 .................................................. 3
4
2
11.
4
.5 MicroprocessorInterface ................................... 3
4
2
11.
4
.5.1 IntelBusInterfaceMode ................................. 3
4
2
11.
4
.5.2 motorolabusinterfacemode.............................. 3
4
5
11.
4
.6 LineInterface ............................................ 3
4
7
11.
4
.7 SystemInterface ......................................... 350
11.
4
.
8
pulsetemplates-传输者............................... 355
11.
4
.
8
.1 PulseTemplateE1 ..................................... 355
11.
4
.
8
.2 pulsetemplatet1...................................... 356
11.5 Capacitances .............................................. 357
11.6 PackageCharacteristics ..................................... 35
8
11.7 TestConfiguration .......................................... 35
9
12 包装 轮廓
.......................................... 360
13 附录
................................................ 361
13.1 ProtectionCircuitry ......................................... 361
13.2 applicationnotes........................................... 362
13.3 软件 支持 ........................................... 362
13.
4
Differences 至 版本 PEB 2255 v1.1 .......................... 36
4
14 Glossary
................................................. 365
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