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d, ddat运算 视图
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2
3
4
8
7
6
5
NC
V
IN−
V
IN+
V
S−
NC
V
S+
V
输出
NC
NC= 非 内部的 连接
THS3091
便条 一个: 这 设备 和 这 power−down 选项 defaults 至 这 在 状态 如果 非 信号 是 应用 至 这 pd管脚. additionallly, 这 ref
管脚 函数的 范围 是 从 v
S−
至 (v
S+
− 4 v).
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REF
V
在 −
V
在 +
V
S−
PD
V
S+
V
输出
NC
d, ddat运算 视图
THS3095
nc = 非 内部的 连接
看 便条 一个.
DISSIPATIONRATINGTABLE
THS3091
THS3095
SLOS423C–SEPTEMBER2003–REVISEDAUGUST2004
thesedeviceshavelimitedbuilt-inesdprotection.theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam
duringstorageorhandlingtopreventelectrostaticdamagetothemosgates.
ODERINGINFORMATION
partnumberpackagetypetransportmedia,quantity
ths3091drails,75
soic-8
ths3091drtapeandreel,2500
ths3091ddarails,75
soic-8-pp
(1)
ths3091ddartapeandreel,2500
电源-向下
ths3095drails,75
soic-8
ths3095drtapeandreel,2500
ths3095ddarails,75
soic-8-pp
(1)
ths3095ddartapeandreel,2500
(1)thepowerpadiselectricallyisolatedfromallotherpins.
POWERRATING
(2)
T
J
=125
°
C
包装
Θ
JC
(
°
c/w)
Θ
JA
(
°
c/w)
(1)
T
一个
=25
°
CT
一个
=85
°
C
d-838.397.51.02w410mw
dda-8
(3)
9.245.82.18w873mw
(1)thisdatawastakenusingthejedecstandardhigh-ktestpcb.
(2)powerratingisdeterminedwithajunctiontemperatureof125
°
c.thisisthepointwheredistortionstartstosubstantiallyincrease.
ThermalmanagementofthefinalPCBshouldstrivetokeepthejunctiontemperatureatorbelow125
°
Cforbestperformanceand
长-termreliability.
(3)theths3091andths3095mayincorporateapowerpad™ontheundersideofthechip.thisactsasaheatsinkandmustbe
connectedtoathermallydissipatingplaneforproperpowerdissipation.failuretodosomayresultinexceedingthemaximumjunction
temperaturewhichcouldpermanentlydamagethedevice.seetitechnicalbriefslma002formoreinformationaboututilizingthe
powerpad™thermallyenhancedpackage.
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