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ABSOLUTEMAXIMUMRATINGS
TYPICALDISSIPATIONRATINGS
RECOMMENDEDOPERATINGCONDITIONS
TPA3100D2
SLOS469B–OCTOBER2005–REVISEDOCTOBER2005
thesedeviceshavelimitedbuilt-inesdprotection.theleadsshouldbeshortedtogetherorthedevice
placedinconductivefoamduringstorageorhandlingtopreventelectrostaticdamagetothemosgates.
overoperatingfree-airtemperaturerange(unlessotherwisenoted)
(1)
单位
V
CC
supplyvoltageavcc,pvcc–0.3vto30v
关闭,mute–0.3vtov
CC
+0.3v
V
I
Inputvoltage
gain0,gain1,rinn,rinp,linn,linp,mstr/slv,
–0.3vtovreg+0.5v
同步
ContinuoustotalpowerdissipationSeeDissipationRatingTable
T
一个
operatingfree-airtemperaturerange–40
°
Cto85
°
C
T
J
Operatingjunctiontemperaturerange
(2)
–40
°
Cto150
°
C
T
stg
Storagetemperaturerange–65
°
Cto150
°
C
leadtemperature1,6mm(1/16inch)fromcasefor10seconds260
°
C
R
加载
loadresistance3.2
Ω
最小
Humanbodymodel
(3)
(allpins)
±
2kV
ElectrostaticdischargeMachinemodel
(4)
(allpins)
±
200V
charged-devicemodel
(5)
(allpins)
±
500V
(1)stressesbeyondthoselistedunder
absolutemaximumratings
maycausepermanentdamagetothedevice.thesearestressratings
仅有的,andfunctionaloperationsofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder
recommendedoperating
情况
isnotimplied.exposuretoabsolute-最大-ratedconditionsforextendedperiodsmayaffectdevicereliability.
(2)thetpa3100d2incorporatesanexposedthermalpadontheundersideofthechip.thisactsasaheatsink,anditmustbeconnected
toathermallydissipatingplaneforproperpowerdissipation.failuretodosomayresultinthedevicegoingintothermalprotection
关闭.seetitechnicalbriefsSCBA017D和SLUA271formoreinformationaboutusingtheqfnthermalpad.seetitechnical
BriefsSLMA002formoreinformationaboutusingthetqfpthermalpad.
(3)inaccordancewithjedecstandard22,testmethoda114-b.
(4)inaccordancewithjedecstandard22,testmethoda115-一个
(5)inaccordancewithjedecstandard22,testmethodc101-一个
PACKAGET
一个
≤
25
°
CDERATINGFACTORT
一个
=70
°
CT
一个
=85
°
C
48-pinqfn4.7w37.7mw/
°
C
(1)
3.02w2.45w
48-pintqfp4.65w37.2mw/
°
C
(2)
2.98w2.42w
(1)thisdatawastakenusing1oztraceandcopperpadthatissoldereddirectlytoajedecstandardhigh-kpcb.thethermalpadmust
besolderedtoathermallandontheprinted-circuitboard.seetitechnicalbriefsSCBA017D和SLUA271formoreinformationabout
usingtheqfnthermalpad.
(2)thisdatawastakenusing1oztraceandcopperpadthatissoldereddirectlytoajedecstandardhigh-kpcb.thethermalpadmust
besolderedtoathermallandontheprinted-circuitboard.seetitechnicalbriefsSLMA002formoreinformationaboutusingtheTQFP
thermalpad.
overoperatingfree-airtemperaturerange(unlessotherwisenoted)
PARAMETERTESTCONDITIONSMINMAXUNIT
V
CC
supplyvoltagepvcc,avcc1026v
关闭,沉默的,gain0,gain1,mstr/slv,
V
IH
高-levelinputvoltage2v
同步
关闭,沉默的,gain0,gain1,mstr/slv,
V
IL
低-levelinputvoltage0.8v
同步
关闭,v
I
=V
CC
,v
CC
=24V125
沉默的,v
I
=V
CC
,v
CC
=24V75
I
IH
高-levelinputcurrentµa
gain0,gain1,mstr/slv,同步,v
I
=vreg,
2
V
CC
=24V
2
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