首页 | 最新需求 | 最新现货 | IC库存 | 供应商 | IC英文资料库 | IC中文资料库 | IC价格 | 电路图 | 应用资料 | 技术资料
 IC型号:
您现在的位置:首页 >  IC英文资料库 进入手机版 
 
资料编号:39924
 
资料名称:30034-23
 
文件大小: 4496.03K
   
说明
 
介绍:
Geode⑩ GXm Processor Integrated x86 Solution with MMX Support
 
 


: 点此下载
  浏览型号30034-23的Datasheet PDF文件第2页
2
浏览型号30034-23的Datasheet PDF文件第3页
3
浏览型号30034-23的Datasheet PDF文件第4页
4
浏览型号30034-23的Datasheet PDF文件第5页
5

6
浏览型号30034-23的Datasheet PDF文件第7页
7
浏览型号30034-23的Datasheet PDF文件第8页
8
浏览型号30034-23的Datasheet PDF文件第9页
9
浏览型号30034-23的Datasheet PDF文件第10页
10
 
本平台电子爱好着纯手工中文简译:截至2020/5/17日,支持英文词汇500个
www.国家的.com 6 修订 3.1
表格 内容
(持续)
Geode™ GXm 处理器
6.0 PowerManagement ............................................. 174
6.1 APMSUPPORT .........................................................174
6.2 CPUSUSPENDCOMMANDREGISTERS ....................................174
6.3 SUSPENDMODULATION .................................................174
6.4 3-voltsuspendmode .................................................174
6.5 SUSPENDMODEANDBUSCYCLES .......................................175
6.5.1 InitiatingSuspendwithSUSP# ......................................175
6.5.2 InitiatingSuspendwithHALT ........................................176
6.5.3 respondingtoapciaccessduringsuspendmode......................177
6.5.4 Stopping 输入 时钟 ...........................................178
6.6 GXM PROCESSORSERIALBUS ..........................................179
6.6.1 SerialPacketTransmission .........................................179
6.7 POWERMANAGEMENTREGISTERS .......................................179
7.0 electricalspecifications.......................................... 182
7.1 PARTNUMBERS........................................................182
7.2 ELECTRICALCONNECTIONS .............................................182
7.2.1 电源/groundconnectionsanddecoupling ............................182
7.2.2 电源 Sequencing 核心 i/o 电压 ...........................182
7.2.3 nc-designatedpins...............................................182
7.2.4 拉-upandpull-downresistors .....................................182
7.2.5 UnusedInputPins ................................................182
7.3 ABSOLUTEMAXIMUMRATINGS ...........................................183
7.4 OPERATINGCONDITIONS................................................184
7.5 DCCHARACTERISTICS ..................................................185
7.6 ACCHARACTERISTICS ..................................................186
8.0 PackageSpecifications .......................................... 195
8.1 THERMALCHARACTERISTICS ............................................195
8.1.1 HeatsinkConsiderations ...........................................196
8.2 MECHANICALPACKAGEOUTLINES........................................198
9.0 instructionset.................................................. 201
9.1 generalinstructionsetformat.....................................202
9.1.1 prefix(optional) .................................................203
9.1.2 Opcode.........................................................203
9.1.3 modandr/mbyte(memoryaddressing) ...............................205
9.1.4 regField ........................................................206
9.1.5 s-i-bbyte(规模,indexing,根基) ....................................207
9.2 CPUIDINSTRUCTION....................................................208
9.2.1 标准 CPUID 水平 . ...........................................208
9.2.2 extendedcpuidlevels............................................210
9.3 PROCESSORCOREINSTRUCTIONSET ....................................212
9.4 FPUINSTRUCTIONSET..................................................224
9.5 MMXINSTRUCTIONSET .................................................229
9.6 国家的 半导体 扩展 MMX 操作指南 设置 . . . . . . . . . . . . . 234
资料评论区:
点击回复标题作者最后回复时间

标 题:
内 容:
用户名:
手机号:    (*未登录用户需填写手机号,手机号不公开,可用于网站积分.)
      
关于我们 | 联系我们
电    话13410210660             QQ : 84325569   点击这里与集成电路资料查询网联系
联系方式: E-mail:CaiZH01@163.com