www.国家的.com 6 修订 3.1
表格 的 内容
(持续)
Geode™ GXm 处理器
6.0 PowerManagement ............................................. 174
6.1 APMSUPPORT .........................................................174
6.2 CPUSUSPENDCOMMANDREGISTERS ....................................174
6.3 SUSPENDMODULATION .................................................174
6.4 3-voltsuspendmode .................................................174
6.5 SUSPENDMODEANDBUSCYCLES .......................................175
6.5.1 InitiatingSuspendwithSUSP# ......................................175
6.5.2 InitiatingSuspendwithHALT ........................................176
6.5.3 respondingtoapciaccessduringsuspendmode......................177
6.5.4 Stopping 这 输入 时钟 ...........................................178
6.6 GXM PROCESSORSERIALBUS ..........................................179
6.6.1 SerialPacketTransmission .........................................179
6.7 POWERMANAGEMENTREGISTERS .......................................179
7.0 electricalspecifications.......................................... 182
7.1 PARTNUMBERS........................................................182
7.2 ELECTRICALCONNECTIONS .............................................182
7.2.1 电源/groundconnectionsanddecoupling ............................182
7.2.2 电源 Sequencing 这 核心 和 i/o 电压 ...........................182
7.2.3 nc-designatedpins...............................................182
7.2.4 拉-upandpull-downresistors .....................................182
7.2.5 UnusedInputPins ................................................182
7.3 ABSOLUTEMAXIMUMRATINGS ...........................................183
7.4 OPERATINGCONDITIONS................................................184
7.5 DCCHARACTERISTICS ..................................................185
7.6 ACCHARACTERISTICS ..................................................186
8.0 PackageSpecifications .......................................... 195
8.1 THERMALCHARACTERISTICS ............................................195
8.1.1 HeatsinkConsiderations ...........................................196
8.2 MECHANICALPACKAGEOUTLINES........................................198
9.0 instructionset.................................................. 201
9.1 generalinstructionsetformat.....................................202
9.1.1 prefix(optional) .................................................203
9.1.2 Opcode.........................................................203
9.1.3 modandr/mbyte(memoryaddressing) ...............................205
9.1.4 regField ........................................................206
9.1.5 s-i-bbyte(规模,indexing,根基) ....................................207
9.2 CPUIDINSTRUCTION....................................................208
9.2.1 标准 CPUID 水平 . ...........................................208
9.2.2 extendedcpuidlevels............................................210
9.3 PROCESSORCOREINSTRUCTIONSET ....................................212
9.4 FPUINSTRUCTIONSET..................................................224
9.5 MMXINSTRUCTIONSET .................................................229
9.6 国家的 半导体 扩展 MMX 操作指南 设置 . . . . . . . . . . . . . 234